Modular data center

ABSTRACT

A modular data center includes a controller; a data center control system configured to collect data center data associated with the modular data center via communication with one of the controller and a plurality of sensors; and a data module connected to a power supply source. The power supply source includes at least one of a power grid, a backup power source and a power module. The power module includes electronics equipment for conditioning and distributing power to the one or more data modules. The data module includes a first enclosure defining a first internal space; and a first sensor in the plurality of sensors. The first sensor is in communication with at least one of the controller and the data center control system. A second sensor in the plurality of sensors is in communication with the power supply source.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a continuation of, claims the benefit of andpriority to U.S. patent application Ser. No. 14/228,103, filed Mar. 27,2014. The '103 application is a continuation of, claims the benefit ofand priority to U.S. patent application Ser. No. 13/751,568, filed Jan.28, 2013. The '568 application is a continuation-in-part of, claims thebenefit of and priority to U.S. patent application Ser. No. 12/626,278,filed Nov. 25, 2009 and titled “System and Method of Providing ComputerResources,” which claims the benefit of and priority to U.S. ProvisionalPatent Application No. 61/119,980 filed Dec. 4, 2008, the contents ofeach are incorporated herein by reference in their entirety. Thisapplication is also continuation of, claims the benefit of and priorityto U.S. patent application Ser. No. 14/243,773, filed Apr. 2, 2014. The'773 application is a continuation of, claims the benefit of andpriority to U.S. patent application Ser. No. 13/751,568, filed Jan. 28,2013. The '568 application is a continuation-in-part of, claims thebenefit of and priority to U.S. patent application Ser. No. 12/626,278,filed Nov. 25, 2009 and titled “System and Method of Providing ComputerResources,” which claims the benefit of and priority to U.S. ProvisionalPatent Application No. 61/119,980 filed Dec. 4, 2008, the contents ofeach are incorporated herein by reference in their entirety.

The entire contents of U.S. patent application Ser. No. 12/626,299,filed Nov. 25, 2009 and titled “Apparatus and Method of EnvironmentalCondition Management for Electronic Equipment,” and U.S. patentapplication Ser. No. 12/626,114, filed Nov. 25, 2009 and titled “ThermalManagement Cabinet for Electronic Equipment,” are incorporated herein byreference in their entirety.

FIELD OF THE TECHNOLOGY

The present technology relates to a modular data center, and inparticular a modular data center system for providing the desiredresources, environmental conditions and infrastructure for electronic orIT equipment

BACKGROUND

Data centers are facilities for housing electronic equipment, such asservers. A data center can occupy one room of a building, one or morefloors, or an entire building. These facilities often have a largefootprint due to the various components necessary for maintaining thefacilities, including cooling equipment. Most of the equipment is oftenin the form of servers mounted in 19 inch rack cabinets, which aretypically placed in single rows forming corridors between them. Thisallows people access to the front and rear of each cabinet. Serversdiffer greatly in size from IU servers to large freestanding storagesilos which occupy many tiles on the floor. Some electronic equipment,such as mainframe computers and storage devices, are often as big as theracks themselves, and are placed alongside them. Local building codescan affect the footprint of the facility and thus the overall cost ofmaintaining the electronic equipment.

Cooling of server racks and cabinets in the facilities can beproblematic, particularly as processors typically produce large amountsof heat. It has been found that for every 1 watt of power used forInformation Technology, 0.5 to 2 watts of power are used for cooling theelectronic components, and thus the need for cooling uses a very highpercentage of the total IT power consumption

The power dissipation of high-performance CPU processors is predicted toexceed 150 W in the near future. The high-density packing of servers andthe desire for lower CPU junction temperatures to achieve higherreliability of components means that thermal management of server racksis an increasing concern. Various solutions have been proposed, many ofwhich involve large numbers of fans to keep a constant airflow over theelectronic components. However, such solutions suffer from drawbacksassociated with the power supply needed to power the fans, as well asreliability of such fans. Moreover, these are generally located in largefacilities which further exacerbates the drawbacks

In a number of solutions, server cabinets are placed on a false floorwith cool air from an HVAC system being supplied through the false floorto a vent in front of the cabinet. The cooling airflow is then drawnfront-to-back through the cabinet using fans, and vented out to the backof the cabinet. With such arrangements, it is desirable to use a“hot-aisle/cold-aisle” arrangement so that server fronts are arrangedfacing one another so that two aisles can draw cool air from a singlevent area, and so that the server backs also face one another. The hotair is then allowed to vent to air return units in the ceiling. This canlead to “hot spots” in the server room, however, much of the hot air canalso mix with the cool air circulating in the room. Various solutions tosuch problems involve the use of baffles extending from the top of theserver cabinet to the ceiling to try to prevent some of the mixingbetween the hot and cold air.

The maximum allowed temperature range for a server in a data center istypically 59 to 90 degrees Fahrenheit, while the recommended temperatureis typically between 68 and 77 degrees Fahrenheit. As the known datacenter storage solutions typically allow some mixing of air prior to theair reaching the electronic components, data centers typically pump coldair at between 55 and 60 degrees Fahrenheit to account for thetemperature increase in the air before it can act to cool thecomponents.

SUMMARY OF THE TECHNOLOGY

Accordingly there is a need for an efficient data center capable ofproviding the power and environmental management required to support ITequipment. Moreover, there is a need for a highly-scalable and rapidlydeployable data center.

In one aspect, there is a data center that can include one or more datamodules. The data center can include a network module connected to theone or more data modules, the network module containing equipment forfacilitating data communications by the one or more data modules. Thedata center can include a power module connected to the one or more datamodules and the network module, the power module containing electronicsequipment for conditioning and distributing power to the one or moredata modules and the network module. Each module of the one or more datamodules, the network module, and the power module can include anenclosure defining an internal space; a floor within the enclosureseparating the internal space into an above-floor space and a sub-floorspace; and a plurality of bays in the subfloor space, each bay of theplurality of bays configured to contain a field-replaceableenvironmental management component.

In some embodiments, the enclosures of the one or more data modules, thenetwork module, and the power module have substantially the samedimensions.

In some embodiments, the data center can include a heat exchanger in afirst bay of the plurality of bays in a data module of the one or moredata modules, the heat exchanger configured to remove heat from airwithin the enclosure of the data module.

In some embodiments, the data center can include a structure disposed inthe above-floor space separating the above-floor space into a firstaisle and a second aisle, and wherein the heat exchanger is furtherconfigured to remove heat from air flowing from the first aisle. In someembodiments, the structure disposed in the above-floor space comprisesone or more cabinets of computing equipment.

In some embodiments, a module of the one or more data modules, thenetwork module, and the power module includes a controller disposed inthe data module and one or more sensors disposed in the data module incommunication with the controller, wherein the controller adjusts anenvironmental parameter of the data module based on one or more signalsfrom the one or more sensors.

In some embodiments, the environmental parameter is one of a temperaturewithin the enclosure, a pressure within the enclosure, a humidity withinthe enclosure, or an airflow speed within the enclosure. In someembodiments, the one or more sensors are one of a temperature sensor,pressure sensor, humidity sensor, fan speed sensor, or valve positionsensor.

In some embodiments, the data center can include a data center controlsystem, wherein each module of the one or more data modules, the networkmodule, and the power module further comprises: one or more sensorsdisposed in the module, and wherein the data center control system isconfigured to receive signals from the one or more sensors in eachmodule of the one or more data modules, the network module, and thepower module.

In some embodiments, the data center can include a humidifier in a firstbay of the plurality of bays in a data module of the one or more datamodules. In some embodiments, the data center can include a networkoperations center in a data module of the one or more data modules.

In another aspect there is a method of deploying a data center. Themethod can include supplying one or more data modules. The method caninclude connecting a network module to the one or more data modules, thenetwork module containing equipment for facilitating data communicationsby the one or more data modules. The method can include connecting apower module to the one or more data modules and the network module, thepower module containing electronics equipment for conditioning anddistributing power to the one or more data modules and the networkmodule. In the method, each module of the one or more data modules, thenetwork module, and the power module can include: an enclosure definingan internal space; a floor within the enclosure separating the internalspace into an above-floor space and a sub-floor space; and a pluralityof bays in the subfloor space, each bay of the plurality of baysconfigured to contain a field-replaceable environmental managementcomponent.

The method can include disposing a heat exchanger in a first bay of theplurality of bays in a data module of the one or more data modules, theheat exchanger configured to remove heat from air within the enclosureof the data module.

The method can include disposing a structure in the above-floor spaceseparating the above-floor space into a first aisle and a second aisle,and wherein the heat exchanger is further configured to remove heat fromair flowing from the first aisle.

In some embodiments, a module of the one or more data modules, thenetwork module, and the power module can include: a controller disposedin the data module; and one or more sensors disposed in the data modulein communication with the controller, wherein the controller adjusts anenvironmental parameter of the data module based on one or more signalsfrom the one or more sensors.

In some embodiments, the environmental parameter is one of a temperaturewithin the enclosure, a pressure within the enclosure, a humidity withinthe enclosure, or an airflow speed within the enclosure. In someembodiments, the one or more sensors are one of a temperature sensor,pressure sensor, humidity sensor, fan speed sensor, or valve positionsensor.

The method can include providing a data center control system, whereineach module of the one or more data modules, the network module, and thepower module further comprises: one or more sensors disposed in themodule, wherein the data center control system is configured to receivesignals from the one or more sensors in each module of the one or moredata modules, the network module, and the power module.

The method can include disposing a humidifier in a first bay of theplurality of bays in a data module of the one or more data modules. Themethod can include disposing a network operations center in a datamodule of the one or more data modules.

In another aspect, there is a method of provisioning a data center. Themethod can include providing one or more data modules based on acomputing capacity parameter. The method can include connecting one ormore network modules to the one or more data modules based on thecomputing capacity parameter and a redundancy parameter, the one or morenetwork modules containing equipment for facilitating datacommunications by the data modules. The method can include connectingone or more power modules to the one or more data modules and the one ormore network modules based on the computing capacity parameter and theredundancy parameter, the one or more power modules containingelectronics equipment for conditioning and distributing power to the oneor more data modules and the one or more network modules, wherein eachmodule of the one or more data modules, the one or more network modules,and the one or more power modules comprises: an enclosure defining aninternal space; a floor within the enclosure separating the internalspace into an above-floor space and a subfloor space; and a plurality ofbays in the subfloor space, each bay of the plurality of bays configuredto contain a field-replaceable environmental management component.

In some embodiments, the computing capacity parameter is one of a powercapacity, a processing capacity, or a storage capacity. In someembodiments, the enclosures of the one or more data modules, the one ormore network modules, and the one or more power modules havesubstantially the same dimensions. The method can include disposing oneor more heat exchangers in the plurality of bays in the one or more datamodules based on the computing capacity parameter and a redundancyparameter.

Other aspects and advantages of the present invention will becomeapparent from the following detailed description, taken in conjunctionwith the accompanying drawings, illustrating the principles of theinvention by way of example only.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other objects, features, and advantages of the presentinvention, as well as the invention itself, will be more fullyunderstood from the following description of various embodiments, whenread together with the accompanying drawings, in which:

FIG. 1A is a perspective schematic view of a data center moduleaccording to an embodiment of the technology.

FIG. 1B is a second perspective schematic view of the data center moduleof FIG. 1A.

FIG. 1C is a top schematic illustration of a data center module housing.

FIG. 1D is a side schematic illustration of a data center modulehousing.

FIG. 1E is a front schematic illustration of a data center modulehousing.

FIGS. 1F, 1G, 1H, and 1I are schematic illustrations of data centermodule housing.

FIGS. 1J, 1K, and 1L are schematic illustrations of a data center modulehousing.

FIGS. 2A, 2B, 2C, and 2D depict an enclosure for use in a modular datacenter.

FIG. 3 depicts a modular data center.

FIG. 4 depicts a perspective view of a data module.

FIG. 5A depicts a perspective view of a data module.

FIG. 5B depicts a top view of a data module showing hot and cold aisles.

FIG. 6 depicts a perspective view of a network module.

FIG. 7 depicts a perspective view of a power module.

FIG. 8 depicts a wiring diagram.

FIG. 9 depicts a cross-section view of an enclosure for use in a modulardata center.

FIG. 10 depicts a cross-section view of an enclosure for use in amodular data center.

FIG. 11 depicts a perspective view of a modular data center.

FIG. 12A depicts a perspective view of a modular data center.

FIG. 12B depicts a cross-section view of a data module, power module,and cooling module.

DETAILED DESCRIPTION

The exemplary embodiments of the present technology are described withrespect to providing resources, environmental conditions andinfrastructure for electronic equipment. It should be understood by oneof ordinary skill in the art that the embodiments of the presenttechnology are merely exemplary and can be applied in otherconfigurations.

Referring to the drawings and in particular FIGS. 1A and 1B, anexemplary mobile data center system 5 is illustrated. The system 5 caninclude a support structure 15 which is capable of being moved tovarious locations, including remote locations, and then connected to anetwork at the new location, such as through a hardwire link, forproviding computer resources. In one embodiment, the support structure15 can be a trailer with wheels that is capable of being towed. Inanother embodiment, the support structure 15 can be a self-containedmoving vehicle; i.e., a drivable vehicle.

The system 5 can include a power sub-system having generator 20 thatprovides power to electronic equipment, such as servers, as well asother sub-systems, including a cooling system and a control system. Inone embodiment, the generator 20 can be a self-contained powergenerating device, such as a diesel generator. However, the presentdisclosure contemplates the use of other power supply devices, which mayor may not be connectable with outside power supply sources, such as thepower grid at the remote location. For example, the power sub-system canbe connectable with the power grid for receiving additional power asneeded. Other power supply sources that can be used to supplement orotherwise provide energy to system 5, can include solar power sources,wind power sources, hydrogen power sources and so forth.

Referring to FIGS. 1C, 1D, and 1E, in one embodiment, a modular datacenter can comprise one or more housings 25 for the electronicequipment, which may have various points of access including rear andtop ports or doors. In one embodiment, doors 30 can provide access tothe inner volume of the housings 25 which can have a raised floor 35,such as a platform with bar gratings. The raised floor 35 can provideaccess for electrical wiring, cooling conduit and the like to individualcabinets that house the servers. The housings 25 can be configured invarious ways including coaxially, such as in FIG. 1A or stacked on eachother as in FIGS. 1F, 1G, 1H, and 1I.

In another embodiment, the housing 25 can be formed using thermallyinsulated walls, including a non-perforated liner. Referringadditionally to FIGS. 1J, 1K, and 1L, the housing 25 can include anumber of access panels 40. A lifting structure 45, such as a lift lug,can be provided to facilitate positioning of the housing 25 with respectto a support structure (e.g., support structure 15).

Data center modules can house electronic equipment (e.g., servers,computer equipment, networking equipment, and/or power storage,generation, or distribution equipment). The electronic equipment can bepositioned in a plurality of cabinets such as arranged in rows withaccess to the rows being provided by the doors 30, although the presentdisclosure also contemplates other configurations for the cabinets. Theparticular configuration of the rows can be selected based on a numberof factors, including facilitating adjustment of environmentalconditions associated with the cabinets and/or maximizing, facilityspace.

In one embodiment, different housings 25 can have different requiredenvironmental conditions. For example, a first housing 25 can includecabinets that are housing servers, which require a large amount ofcooling while a second housing includes cabinets housing routers thatrequire a smaller amount of cooling. By grouping the cabinets accordingto environmental requirements (e.g., desired temperature and humidityranges), system 5 can more efficiently control the environmentsassociated with the particular electronic equipment.

As described above, system 5 can include a cooling sub-system fordelivery of a cooling fluid to each of the cabinets. The particularconfiguration of the cooling system, including the positioning of thevarious components, such as a chiller, conduits, fans and so forth, canvary. In one embodiment, the cooling, fluid can comprise air, such asdelivered through the use of pressurized plenums. The particular conduitconfiguration for delivery of the air to the cabinets can vary. Forexample, an air supply channel can supply cooling air to multiplecabinets and/or multiple rows of cabinets. In one embodiment, eachcabinet can be connected directly to an air supply channel so that eachcabinet receives air that flows directly from the cooling subsystemrather than from another cabinet. In another embodiment, the cabinetscan be arranged or grouped so that a portion of the cabinets receivecooling in series. For example, a first group of cabinets requiring alarge amount of cooling can directly receive air that has been cooled bythe cooling subsystem. This cold air can flow across the electronicequipment of the first group of cabinets and then can be directedtowards a second Group of cabinets that require a smaller amount ofcooling. The air can then be returned to the cooling subsystem forremoval of the heat that has been transferred to the air by the firstand second groups of cabinets.

FIGS. 2A, 2B, and 2C depict an enclosure 205 for use in a modular datacenter. In the illustrated embodiment, floor 210 is disposed in theinterior of enclosure 205, creating above-floor space 215 and sub-floorspace 220. Above-floor space 215 can accommodate, for example, ITequipment (e.g., servers, storage systems, networking equipment, etc.),power generation, storage, and distribution equipment, and/or any otherequipment. Sub-floor space 220 contains bays 225 a-225 j. Bays 225 a-225j can contain environmental management components (not shown) formonitoring and/or controlling the environmental conditions (e.g.,temperature, humidity, air pressure, etc.) of above floor space 215and/or other equipment for monitoring, controlling, and maintaining theoperation of a data center. Chilled fluid supply pipe 230 and fluidreturn pipe 235 can be disposed in sub-floor space 220.

In some embodiments, one or more of bays 225 a-225 j contain air handlerunits (AHUs). An AHU can connect to chilled fluid supply pipe 230 andfluid return pipe 235. Chilled fluid supply pipe 230 can provide chilledfluid to and fluid return pipe 235 can carry fluid away from an AHU foruse in removing heat energy from the above-floor space, as willexplained in greater detail below. In some embodiments, one or more ofbays 225 a and or 225 j can contain makeup air handler units (MAUs).MAUs can be used to regulate the environment in the above-floor space bydrawing air from outside the enclosure into the interior and expellingair from inside the enclosure (e.g., for maintaining humidity and/orsupplying fresh air). In some embodiments, refrigerant can be suppliedto the enclosure 205 for cooling the above-floor space 215. One or moreof bays 225 a-225 j can contain refrigerant-based cooling equipment (notshown) to maintain the environmental conditions (e.g., temperature,humidity, air pressure, etc.) of above-floor space 215.

In some embodiments, the environmental management components are fieldreplaceable and/or hot-swappable. Access space 240 runs along length 245of sub-floor space 220 of enclosure 205 and adjacent to bays 225 a-225b. During maintenance, an environmental component can be moved from abay (e.g., bays 225 a-225 j) into the adjacent and connecting accessspace 240 and then removed through the end of enclosure 205. A newenvironmental component can similarly be placed in a bay (e.g., bays 225a-225 j) through access space 240. In some embodiments, the number ofenvironmental management components (e.g., AHUs) in the enclosure isvariable depending on the cooling needs of the IT equipment in theenclosure. The number of environmental management components can also beadjusted during operation to scale cooling capability of the enclosureup or down.

FIG. 2D depicts the exterior of enclosure 205. Enclosure 205 can includeexterior walls 250 enclosing the interior of enclosure 205. Wall 250 canbe made of a variety materials, including, for example, metals,plastics, or other materials depending on the intended environment anduse of enclosure 205. Enclosure 205 can include access doors 255 foraccessing its interior.

Modular Data Center

FIG. 3 depicts a modular data center 300. In the illustrated embodiment,modular data center 300 includes data modules 305, network module 310,and power modules 315. Modular data center 300 includes chiller modules320. Chiller modules 320 can provide chilled fluid to data modules 305,network module 310, and power modules 315 via chilled fluid supply pipe330 and fluid return pipe 335. Modular data center 300 includesgenerator modules 340 and fuel tanks 345. Fuel tanks 345 can providefuel to generator modules 340 to produce electricity for data center300. In some embodiments, generator modules 340 can generate electricityfor modular data center during normal operation. In some embodiments,generator modules 340 provide backup electricity for modular data center300 when a primary electricity source (e.g., a utility grid) is nolonger available.

As discussed above, modular data center 300 can include data modules305, network module 310, and power modules 315. FIG. 4 depicts aperspective view of data module 400. Data module 400 can be based on,for example, enclosure 205 of FIGS. 2A-2D. As illustrated, data module400 includes sub-floor space 405 that can be used to house variousequipment as described above. For example, sub-floor space 405 cancontain environmental management components for monitoring and/orcontrolling the environmental conditions (e.g., temperature, humidity,air pressure, etc.) and/or other equipment for monitoring, controlling,and maintaining the operation of a data center. In the illustratedembodiment, air handler 407 is shown in sub-floor space 405.

Data module 400 includes an above-floor space that includes hot aisle410 and cold aisle 415. In the illustrated embodiment, hot aisle 410 andcold aisle 415 are at least partially separated by IT equipment 420. ITequipment 420 can include servers, storage systems, and/or networkingequipment. In some embodiments (not shown), hot aisle 410 and cold aisle415 are at least partially separated by a barrier, such as the barriersdescribed in U.S. patent application Ser. No. 12/837,167, titledApparatus and Method for Regulating Various Conditions AffectingElectronic Equipment, and filed Jul. 15, 2010, the contents of which arehereby incorporated by reference. Such barriers, for example, can beused to provide greater separation of hot aisle 410 and cold aisle 415.In some embodiments, an air pressure differential between hot aisle 410and cold aisle 415 is maintained by environmental management componentsin sub-floor space 405. As described in greater detail below, the airpressure differential can facilitate cooling IT equipment and reducehot/cold aisle recirculation.

While data module 400 is illustrated with IT equipment 420 dividing theabove-floor space into hot aisle 410 and cold aisle 415, it should beappreciated that data module 400 can accommodate any arrangement of ITequipment in the above-floor space.

FIG. 5A depicts a perspective view of data module 500. As illustrated,data module 500 includes sub-floor space 505 that can house variousequipment as described above. For example, sub-floor space 505 cancontain environmental management components for monitoring and/orcontrolling the environmental conditions (e.g., temperature, humidity,air pressure, etc.) and/or other equipment for monitoring, controlling,and maintaining the operation of a data center. In the illustratedembodiment, data module 500 includes two rows of environmentalmanagement equipment, row 510 a and row 510 b. Rows 510 a and 510 b canfacilitate creating multiple hot, cold, or mixed-air aisles inabove-floor space 515, as will be described in greater detail below.Data module 500 can include chilled fluid supply pipes 520 and fluidreturn pipes 525 disposed in sub-floor space 505 for supplying chilledfluid to the environmental management equipment.

In the illustrated embodiment, above-floor space 515 is separated intohot aisles 530 and mixed-air aisles 535. Hot aisles 530 and mixed-airaisles 535 are at least partially separated by IT equipment 540.

FIG. 5B depicts a top view of data module 500 showing hot and mixed-airaisles 530 and 535. Data module 500 contains three rows of IT equipment540, row 542 a, row 542 b, and row 542 c. Rows 542 a, 542 b, and 542 ccan be positioned to create multiple hot and mixed-air aisles inabove-floor space 515 (e.g., hot aisles 530 and mixed-air aisles 535).In the illustrated embodiment, the pieces of IT equipment in rows 542 aand 542 c are positioned such that warm air from the IT equipment isexhausted into hot aisles 530. The pieces of IT equipment in row 542 bcan be positioned such that the pieces of IT equipment alternate so thatadjacent pieces of IT equipment exhaust warm air in opposite directions,forming mixed-air aisles 535. IT equipment 540 can include servers,storage systems, and/or networking equipment. In some embodiments (notshown), hot aisles 530 and mixed-air aisles 535 are at least partiallyseparated by a barrier. Such barriers, for example, can be used toprovide greater separation of hot aisles 530 and mixed-air aisles 535.In some embodiments, an air pressure differential between hot aisles 530and mixed-air aisles 535 is maintained by environmental managementcomponents. As described in greater detail below, the air pressuredifferential can facilitate cooling IT equipment and reducerecirculation.

Data module 500 includes power distribution units (PDUs) 545, whichdistribute electrical power to IT equipment 540 and any environmentalmanagement equipment. Data module 500 includes remote power panels(RPPs) 550, which distribute power from, for example, a power module toPDUs 545.

FIG. 6 depicts a perspective view of network module 600. Network module600 can be based on, for example, enclosure 205 of FIGS. 2A-2D. Asillustrated, network module 600 includes sub-floor space 605 that canhouse various equipment as described above. For example, sub-floor space605 can contain environmental management components for monitoringand/or controlling the environmental conditions (e.g., temperature,humidity, air pressure, etc.) and/or other equipment for monitoring,controlling, and maintaining the operation of a data center.

Network module 600 includes an above-floor space that includes hot aisle610 and cold aisle 615. In the illustrated embodiment, hot aisle 610 andcold aisle 615 are at least partially separated by networking equipment620. Networking equipment 620 can include networking equipment, such asnetwork switches and/or routers. In some embodiments (not shown), hotaisle 610 and cold aisle 615 are at least partially separated by abarrier, as described above with reference to FIG. 4. In someembodiments, an air pressure differential between hot aisle 610 and coldaisle 615 is maintained by environmental management components insub-floor space 605. As described in greater detail below, the airpressure differential can facilitate cooling IT equipment and reducehot/cold aisle recirculation.

FIG. 7 depicts a perspective view of power module 700. Power module 700can be based on, for example, enclosure 205 of FIGS. 2A-2D. Asillustrated, power module 700 includes sub-floor space 705 that canhouse various equipment as described above. For example, sub-floor space705 can contain environmental management components for monitoringand/or maintaining the environmental conditions (e.g., temperature,humidity, air pressure, etc.) and/or other equipment for monitoring,controlling, and maintaining the operation of a data center.

Power module 700 includes an above-floor space 710. In the illustratedembodiment, above-floor space 710 contains power equipment 715. Powerequipment 710 can include equipment for conditioning and distributingpower to, for example, data modules 400 and 500 and network module 600.Power equipment 715 can include generators, transformers, powerdistribution panels/switches, and/or UPS systems.

FIG. 8 depicts a wiring diagram. FIG. 8 illustrates the connectionsbetween PDU 805 and IT equipment 810 and mechanicals 815. PDU 805 can behoused in a data module (e.g., data module 400 or 500) and connected toa power modules (e.g., power module 700). PDU 805 can be configured todistribute power to IT equipment 810 and mechanicals 815. IT equipment810 can include IT equipment in one or more data modules (e.g., datamodules 400 and 500) and/or networking equipment in one or morenetworking modules (e.g., network module 600). Mechanicals 815 caninclude environmental management components for monitoring and/orcontrolling the environmental conditions (e.g., temperature, humidity,air pressure, etc.) and/or other equipment for monitoring, controlling,and maintaining the operation of a data center in one or more datamodules (e.g., data modules 400 and 500) and/or one or more networkingmodules (e.g., network module 600).

In the illustrated embodiment, PDU includes a transformer 820 for powerdistributed to IT equipment 810 and a transformer 825 for powerdistributed to mechanicals 815. By utilizing separate transformers forIT equipment 810 and mechanicals 815, PDU 805 can provide power properlyconditioned for the equipment in the module. Utilizing transformer 820and transformer 825 can facilitate isolating IT equipment electricalloads from mechanical or support infrastructure electrical loads.

Returning to FIG. 3, modular data center 300 can provide the power,communications, and environmental requirements for IT equipment inmodular data center 300. As described above, power modules (e.g., powermodules 315) can distribute power to the data modules (e.g., datamodules 305) to meet the requirements of the contained IT equipment,along with any components in the sub-floor space. Network module 310 canprovide data communication for the contained IT equipment.

With respect to environmental management, any of the modules (e.g., datamodules 305, network module 310, or power modules 315) in modular datacenter 300 can include one or more sensors (e.g., temperature sensor,pressure sensor, humidity sensor, fan speed sensor, valve positionsensor, etc.) disposed in the module in communication with a controllerin the module. In some embodiments, the controller can monitor thesignals from the sensors and adjust environmental parameters (e.g.,temperature, air pressure, humidity, airflow speed, etc.) of the module.

In some embodiments, the controller can determine the differentialpressure between the hot aisle and the cold aisle and modulate the speedof the fans in the AHUs to maintain a desired pressure differentialbetween the hot and cold aisles.

In some embodiments, the controller can determine that the temperaturewithin a modules exceeds a certain threshold and increase the speed ofthe fans in the AHUs to lower the temperature. In some embodiments, thecontroller can increase the flow of chilled fluid by opening the chilledfluid supply valve, thereby increasing the flow of chilled fluid to theAHUs to lower the temperature.

Modular data center 300 can include a data center control system 380.The data center control system 380 can be connected to one or more ofthe modules in the data center and collect information from the sensorsdiscussed above. In some embodiments, the data center control system 380can be connected to the IT equipment, environmental managementequipment, and power generation and distribution equipment to collectdata about the operation of the equipment.

Module Cooling

As discussed above, modules can provide environmental management by, forexample, removing heat generated by IT equipment from the module. FIG. 9depicts a cross-section view of an enclosure 1050 for use in a modulardata center. The illustrated embodiment can be used, for example, as adata module. Enclosure 1050 contains cabinets 10 of IT equipments.Cabinets 10 can be in fluid communication with a pressurized plenum1210. The particular number of plenums 1210 used can vary. In anotherexample, multiple pressurized plenums 1210 can be utilized, such as oneor more plenums being utilized for each row. The plenum 1210 can haveone or more pressure sources, such as fan 1215, although other pressuresources are also contemplated including pumps and the like.

In one embodiment, the fan 1215 can be a centrifugal fan. The fan 1215can include noise-absorption components and anti-vibration mountingcomponents. Various filters and other components can be utilized incombination with the fan. In one embodiment, the fan 1215 can be anadjustable speed fan to increase or decrease the pressure in the plenum1210. For example, the fan 1215 can be a variable frequency drive fan.In another embodiment, a plurality of fans 1215 can be in communicationwith the pressurized plenum 1210 so that the pressure can be increasedby operating additional fans of the plurality of fans. The presentdisclosure also contemplates the fan configuration being modular. Forinstance, the fans 1215 can be easily added to the plenums, such as byremoving a blocking plate that seals a wall of the plenum in the absenceof the fan.

The cabinets 10 can be bound on a first side by a cold zone 1110 andbound on a second side by a hot zone 1111. In the exemplary embodimentshown, the cold and hot zones 1110, 1111 are access areas that havedoors 1105 so that technicians can access the cabinets when needed (suchas for adding or removing the electronic equipment). However, thepresent disclosure also contemplates the cold and hot zones 1110, 1111being integrally formed with the cabinets 10 and/or defined by aninsulated false wall between the access areas and the cabinets. In theexemplary embodiment of FIG. 15, each cabinet in a row share a cold zone1110 and a hot zone 1111. However, the present disclosure contemplatesother configurations of cold and hot zones 1110, 1111, such asindividual cabinets or groups of cabinets in a single row having theirown cold and hot zones. Adjacent hot and cold zones 1111, 1110 can beseparated by a wall (not shown).

The pressurized plenum 1210 can generate a pressure differential betweenthe cold zone 1110 and the hot zone 1111 thereby causing air to flowacross the electronic equipment in the cabinets which removes heat fromsaid equipment. The number and configuration of plenums that areutilized to generate the desired pressure differential can vary based ona number of factors, including the type of electronic equipment that isbeing environmentally managed. For example, a plurality of plenums 1210can be in fluid communication with the cold and hot zones 1110, 1111 ofeach row. The pressurized plenums can generate positive pressure and/ornegative pressure to create the desired pressure differential andthereby create air flow over the electronic equipment. For instance, afirst pressurized plenum can generate a positive pressure (e.g., adesired pressure above ambient) in proximity to the cold zone 1110,while a second pressurized plenum generates a negative pressure (e.g., avacuum) in proximity to the hot zone 1111.

In one embodiment, the use of pressurized plenums 1210 allows system 5to isolate fans from the electronic equipment. For example, thepressurized plenums 1210 can increase air pressure using pumps so thatthe system does not utilize any fans. In another example, the pressureincrease can result from the use of fans that are positioned remotelyfrom the cabinets so that air flow from the fans does not directlycontact the electronic equipment (e.g., the fans create air flow withinthe plenum that results in an increased pressure in the plenum which isin tum communicated to the cabinets).

The air passing over the electronic equipment is utilized to remove heatfrom the equipment. In tum, the cooling subsystem can then remove theheat from the air. In one embodiment, the cooling subsystem can be avapor-compression cycle system, although other systems are alsocontemplated by the present disclosure. The subsystem can include a pumpand one or more chillers for cooling water or other coolant (e.g.,chilled liquid settings between 15 and 50 degrees Fahrenheit) which isthen supplied to coils via supply lines and return lines. The coils 1175can be positioned in thermal communication with the hot zone 1111. Forexample, the coil 1175 can be positioned under the floor 160 so that theair coming from hot zone 1111 passes through the coil 1175 then throughthe pressurized plenum 1210 and back into the cold zone 1111. Theparticular number and configuration of coils 1175 that are utilized canvary based on a number of factors, including the number of pressurizedplenums and configuration of the cold and hot zones that are beingutilized. For example, each row of cabinets 10 can have sixequidistantly positioned pressurized plenums 1210 under the floor 160with a coil 1175 in thermal communication with each of the plenums(e.g., positioned downstream of the hot zone 1111 and upstream of thecold zone 1110 for each plenum).

To control the environment surrounding the electronic equipment, acontroller 1180 can be utilized. The controller can be a machine withinwhich a set of instructions, when executed, may cause the machine toperform any one or more of the methodologies discussed herein. In someembodiments, the machine can operate as a standalone device. In someembodiments, the machine may be connected (e.g., using a network) toother machines. In a networked deployment, the machine may operate inthe capacity of a server or a client user machine in server-client usernetwork environment, or as a peer machine in a peer-to-peer (ordistributed) network environment. The machine may comprise a servercomputer, a client user computer, a personal computer (PC), a tablet PC,a laptop computer, a desktop computer, a control system, or any machinecapable of executing a set of instructions (sequential or otherwise)that specify actions to be taken by that machine. Further, while asingle machine is illustrated, the term “machine” shall also be taken toinclude any collection of machines that individually or jointly executea set (or multiple sets) of instructions to perform any one or more ofthe methodologies discussed herein.

The controller 1180 can be in communication with one or more sensors forreceiving environmental information associated with the electronicequipment. For example, one or more temperature sensors 1225 and one ormore pressure sensors 1235 can be positioned with respect to theelectronic equipment so that the sensors can capture environmentalinformation and transmit the information to the controller 1180. Theparticular positioning of the sensors can vary. For instance,temperature sensors 1225 can be placed both upstream and downstream ofthe coil 1175 so that the cooling efficiency of the coil can be easilymonitored, while other temperature sensors can be placed in closeproximity to the electronic equipment so that the amount of heat beinggenerated by the electronic equipment can be more easily monitored. Thepressure sensors 1235 can be placed both upstream and downstream of thepressurized plenum 1210 so that the pressure differential can be moreeasily monitored. The type of sensor used to capture the environmentalinformation can also vary, including pressure and temperaturetransducers and thermocouples.

In one embodiment, other sensors can also be used to further monitor theenvironmental conditions associated with the electronic equipment, suchas humidity sensors 1240 and flow sensors 1245. The humidity sensors1240 allow the controller 1180 to monitor the humidity that theelectronic equipment is being exposed to and to adjust the humidityaccordingly, such as through use of a de-humidifier 1112 that is influid communication with the electronic equipment. The flow sensors 1245allow the controller 1180 to monitor the flow rate of air, such as fordetermining heat transfer via convection. The use of flow sensors 1245can also be used for determining other environmental characteristics,such as air flow turbulence, that can have an adverse impact on thecooling of the electronic equipment or the equipment itself. In someembodiments, the controller 1180 may use data from fan speed sensor 1250associated with fan 1215 and/or valve position sensor 1255 associatedwith coolant flowing through coil 1175.

The sensors can communicate with the controller 1180 via hardwire (e.g.,cables 1181) and/or wireless links 1182. The particular communicationprotocols that are utilized can vary and can include Wireless Fidelityor WiFi services, Bluetooth, GSM, CDMA, UMTS, WiMAX, MODBUS and soforth. A combination of communication techniques can also be utilized,such as allowing the sensors to communicate both wirelessly and viahardwire to provide redundancy so that data is not lost in the event ofa link failure.

The controller 1180 can receive the environmental information from thesensors and adjust the environmental conditions accordingly. In oneembodiment, each of the cabinets 10 can have a range of environmentalconditions that are acceptable. In real time, the controller 1180 canreceive the environmental information associated with each of thecabinets 10 and then in real time can adjust one or more of thetemperature, pressure and humidity associated with the cabinets.

For example, the controller 1180 can determine that a first cabinet 10needs to lower its temperature by a desired amount. The controller 1180can then transmit control signals for making the appropriate adjustmentto achieve the desired temperature change. For instance, the controller1180 can transmit a control signal to the cooling subsystem to increasecoolant flow to the coil 1175 that is associated with the particularcabinet or to decrease the temperature of the coolant that is beingprovided to the coil. In one embodiment, the controller 1180 cantransmit a control signal to the cooling subsystem which designated adesired temperature and the subsystem can then implement the necessarysteps to achieve the desired temperature. As another example, thecontroller 1180 can transmit a control signal to the pressurized plenumthat is associated with the particular cabinet so that the pressuredifferential is increased thereby increasing the air flow through theparticular cabinet. In one embodiment, the controller 1180 canindependently utilize the pressurized plenum 1210 and the coolingsubsystem to adjust the temperature associated with a particularcabinet. In another embodiment, the controller 1180 can utilize both ofthe pressurized plenum 1210 and the cooling subsystem to adjust thetemperature associated with a particular cabinet.

As another example, the controller 1180 can determine that a firstcabinet 10 needs to decrease its air flow rate through the cabinet 10 adesired amount. The controller 1180 can then transmit control signalsfor making the appropriate adjustment to achieve the desired air flowrate. For instance, the controller 1180 can transmit a control signal tothe pressure source 1215 of the pressurized plenum to decrease thepressure within the plenum that is associated with the particularcabinet. In one embodiment, a damper 1120 can be utilized for air flowcontrol. For instance, the damper 1120 can be positioned downstream ofthe pressurized plenum 1210 and opened or closed using an actuator 1122(e.g., a servo-motor or other movable control device). In this example,the controller 1180 can restrict air flow to the particular cabinet bysending, control signals to the actuator 1122 which results in thedamper moving towards a closed position.

Controller 1180 can also utilize historical information to provideenvironmental management for the cabinets 10. For example, thecontroller 1180 can monitor the temperature of particular cabinets basedon particular times of the day and adjust the environmental conditionsof the cabinets in anticipation of those temperatures. For instance,historical data may show that electronic equipment in a particularcabinet is typically being used to capacity during the morning with aresulting elevation of cabinet temperature during those morning hours.The controller 1180 can adjust the temperature in the particular cabinetto a lower portion of the desired range in anticipation of the increasedtemperature in the morning. The historical data can be maintained in amemory of the controller 1180 or can be stored elsewhere and retrievedby the controller.

Controller 1180 can also maintain historical information associated withthe efficiency of the thermal control being implemented by thecontroller. For example, the controller 1180 can implement severaldifferent techniques for achieving a desired environmental condition andcompare the techniques to determine which was the most efficient. Forinstance, where a temperature decrease is needed, the controller 1180can on a first occasion utilize an increase in pressure differential toachieve the lower temperature. On a second occasion, the controller 1180can utilize the cooling subsystem to achieve the lower temperature. Thecontroller 1180 can then determine efficiency based on such factors asthe amount of time needed to achieve the lower temperature, the amountof power utilized in achieving the lower temperature and so forth. Inthis example, the controller 1180 can then utilize this historicalinformation to determine which thermal management techniques should beutilized in the future based on the particular circumstances.

In one embodiment, other factors can also be analyzed by the controller1180 for determining the particular technique to utilize to achieve thedesired environmental condition. For instance, vibration or noise can bemonitored with respect to the use of certain components of the system 5and the amount of vibration or noise can be a factor in determiningwhich technique (e.g., which cooling components) should be utilized.

FIG. 10 depicts a cross-section view of an enclosure 10000 for use in amodular data center. Enclosure 10000 contains floor 10001 that dividesthe interior of enclosure 10000 into above-floor space 10001 andsub-floor space 10002. Enclosure 10000 can be used, for example, as adata module, a network module, or a power module. In the illustratedembodiment, enclosure 10000 is configured as a data module and containsIT equipment 10005. Enclosure 10000 contains AHU 10010, which issupplied chilled fluid by chilled fluid supply pipe 10015 and fluidreturn pipe 10020. Enclosure 10000 contains flexible barrier 10025.

IT equipment 10005 can be in fluid communication with pressurized plenum10030. Pressurized plenum 10030 can have one or more pressure sources,such as AHU 10010. AHU 10010 can include a variable-speed,variable-frequency-drive fan. AHU 10010 can be in communication withpressurized plenum 10030 and configured to increase the pressure withinpressurized plenum 10030 (e.g., by activating its fan). IT equipment10005 can separate above-floor space 10001 into cold aisle 10032 and hotaisle 10035. In the illustrated embodiment, cold aisle 10032 and hotaisle 10035 can provide technicians access to the IT equipment 10005.Flexible barrier 10025 can facilitate separation of cold aisle 10032 andhot aisle 10035 (alone and/or in conjunction with IT equipment 10005.

AHU 10010 can increase the pressure within pressurized plenum 10030 togenerate a pressure differential between cold aisle 10032 and hot aisle10035, thereby causing air 10040 to flow across and/or through ITequipment 10005 the electronic equipment. The flow of air 10040 acrossand/or through IT equipment 10005 can remove heat from IT equipment10005. In turn, AHU 10010, by use of, for example, a heat exchanger, canthen remove the heat from the air 10040. In some embodiments, the AHUutilizes a vapor-compression cycle heat exchanger. AHU 10010 cantransfer the heat to chilled fluid from chilled fluid supply pipe 10015,which can then be expelled via fluid return pipe 10020.

Modular Data Center Provisioning

The modular data center technology described above permits scalableprovisioning and deployment of data centers based on computing needs. Insome embodiments, a data center can be provisioned based on a computingcapacity parameter and a redundancy parameter. The number of datamodules, network modules, and power modules required for the modulardata center can be determined based on the computing capacity parameterand the redundancy parameter.

As an illustrative example, a data center can be provisioned based on aspecific amount of kilowatts or KW (“Required KW”) and redundancy(“Required Redundancy”). The Required KW can be the amount of peak powerrequired by the IT equipment that will be housed in the modular datacenter. The Required Redundancy can be the level of redundancy in powersupply, backup, cooling, and data bandwidth required by the ITequipment.

One or more data modules can be provided based on the Required KW. Forexample, the number of the data modules can be determined based on theamount of cooling capacity required to maintain IT equipment consumingthe Required KW.

One or more network modules can be provided to facilitate networkcommunications by the IT equipment housed in the data modules. Forexample, the number of network modules can be determined based on theRequired KW (e.g., as an indication of the anticipated IT equipmentactivity) and the Required Redundancy.

One or more power modules can be provided to distribute power to thedata modules and network modules. For example, the number of powermodules can be determined based on the Required KW, in addition to thepower required by the network module or modules and the environmentalmanagement equipment in the data modules.

FIG. 11 depicts a perspective view of a modular data center 11000.Modular data center 11000 can be based on, for example, enclosure 205 ofFIGS. 2A-2D. As illustrated, modular data center 11000 includessub-floor space 11005 that can house various equipment as describedabove. For example, sub-floor space 11005 can contain environmentalmanagement components for monitoring and/or controlling theenvironmental conditions (e.g., temperature, humidity, air pressure,etc.) and/or other equipment for monitoring, controlling, andmaintaining the operation of a data center. In the illustrated example,sub-floor space 11005 contains AHU s 11006 and free-air handler units11007. Free-air handler units 11007 utilize air external to modular datacenter 11000 to remove heat energy from the interior of modular datacenter 11000.

Modular data center 11000 includes an above-floor space 11009. In theillustrated embodiment, above-floor space 11009 contains IT equipment11010. IT equipment 11010 can include servers, storage systems, and/ornetworking equipment. In the illustrated embodiment, above-floor space11007 contains power generation and distribution equipment 11015. Powergeneration and distribution equipment 11015 can include powergenerators, PDU s, UPS systems to provide and maintain power supplied toIT equipment 11010 and the equipment in sub-floor space 11005. Byincluding power generation and distribution equipment 11015, modulardata center 11000 can operate without connections to external utilities,such as electricity and chilled water.

FIG. 12A depicts a perspective view of a modular data center 12000.Modular data center 12000 includes data module 12005, data module 12010,power module 12015, cooling module 12020, and cooling module 12025. Inthe illustrated embodiment, data module 12005 and data module 12010 canhouse, for example, IT equipment. Cooling module 12020 and coolingmodule 12025 can provide chilled fluid to data module 12005 and datamodule 12010, respectively, via one or more pipes (not shown) tofacilitate maintaining the environmental conditions in data module 12005and data module 12010. Power module 12015 can provide power to datamodule 12005, data module 12010, cooling module 12020, and coolingmodule 12025 via one or more electrical connections. While theillustrated data center (data center 12000) is shown with two datamodules (data module 12005 and data module 12010), two cooling modules(cooling module 12020 and cooling module 12025) and one power module(power module 12015), it should be appreciated that the describedtechnology supports other configurations and can scale to meet IT powerand cooling needs. It should be appreciated that such otherconfigurations and scaling may include any ratio amongst similar ordiffering module types. For example, in some embodiments, a power modulecan provide power to 3 or more data modules and 2 or more coolingmodules. In some embodiments, a cooling module can provide chilled fluidto more than one data modules. In some embodiments, the data center caninclude more than one power modules, along with multiple data modulesand cooling modules.

FIG. 12B depicts a cross-section of data module 12005, power module12015, and cooling module 12020. As illustrated, data module 12005includes sub-floor space 12100 that can be used to house variousequipment as described above. For example, sub-floor space 12100 cancontain environmental management components for monitoring and/orcontrolling the environmental conditions (e.g., temperature, humidity,air pressure, etc.) and/or other equipment for monitoring, controlling,and maintaining the operation of a data center. In the illustratedembodiment, sub-floor space 12100 includes AHUs 12105, MAU 12107, andPDUs 12110. In some embodiments, sub-floor space 12100 may be accessiblefrom inside data module 12005. In some embodiments, subfloor space 12100may be inaccessible from inside data module 12005 to accommodate, forexample, partitioning of personnel that have access to the data modulearea and the sub-floor space area. As described above, AHUs 12105 canremove heat energy from the above-floor space 12120. MAU 12107 canregulate the environment in above-floor space 12120 by drawing air fromoutside data module 12005 into its interior and expelling air frominside data module 12005 (e.g., for maintaining humidity and/orsupplying fresh air). PDUs 12110 can distribute electrical power frompower module 12015 to IT equipment 12120 and any environmentalmanagement equipment (e.g., AHUs 12105 and MAU 12107).

Data module 12005 includes above-floor space 12120. Above-floor space12120 can include IT equipment 12125. In the illustrated embodiment, ITequipment 12125 can divide above-floor space 12120 into a hot aisle andcold aisle. IT equipment 12125 can include servers, storage systems,and/or networking equipment. In some embodiments, the hot aisle and coldaisle are at least partially separated by a barrier, such as thebarriers described in U.S. patent application Ser. No. 12/837,167,titled Apparatus and Method for Regulating Various Conditions AffectingElectronic Equipment, and filed Jul. 15, 2010. Such barriers, forexample, can be used to provide greater separation of the hot aisle andcold aisle. In some embodiments, an air pressure differential betweenthe hot aisle and cold aisle is maintained by environmental managementcomponents in sub-floor space 12100. As described in greater detailabove, the air pressure differential can facilitate cooling IT equipmentand reduce hot/cold aisle recirculation.

While data module 12005 is illustrated with IT equipment 12125 dividingthe above-floor space into a hot aisle and cold aisle, it should beappreciated that data module 12005 can accommodate any arrangement of ITequipment in above-floor space 12120.

Cooling module 12020 includes cooling units 12205. In some embodiments,cooling units 12205 are heat exchangers that remove heat energy fromfluid and provide chilled fluid to data module 12005. Cooling units12205 can utilize water, refrigerant, gas, or other kinds of fluid. Insome embodiments, one or more of cooling units 12205 can provide chilledfluid to AHUs 12105 to facilitate removing heat from the interior ofdata module 12005. In some embodiments, one or more of cooling units12205 can provide chilled fluid to MAU 12107 to facilitate removing heatfrom outside air before the air is introduced into the interior of datamodule 12005.

Power module 12015 includes generator 12305 and UPS 12310. Generator12305 can include an integrated fuel tank for storing fuel to power thegenerator. In some embodiments, power module 12015 can be connected tothe electrical utility grid. Power module 12015 can provide power todata module 12005 and cooling module 12020 from the utility grid. UPS12310 can be configured to provide power to data module 12005 andcooling module 12020 based upon intelligent business rules. For example:a failure of the utility grid may be detected and a business rule maydirect a control function of the UPS 12310 to provide power untilgenerator 12305 begins generating power; a business rule may determinethat it is preferable (e.g. cheaper) to obtain power from UPS 12310 fora determined time period; etc.

The methodology and techniques described with respect to the exemplaryembodiments can be performed using a machine or other computing devicewithin which a set of instructions, when executed, may cause the machineto perform any one or more of the methodologies discussed above. In someembodiments, the machine operates as a standalone device. In someembodiments, the machine may be connected (e.g., using a network) toother machines. In a networked deployment, the machine may operate inthe capacity of a server or a client user machine in server-client usernetwork environment, or as a peer machine in a peer-to-peer (ordistributed) network environment. The machine may comprise a servercomputer, a client user computer, a personal computer (PC), a tablet PC,a laptop computer, a desktop computer, a control system, a networkrouter, switch or bridge, or any machine capable of executing a set ofinstructions (sequential or otherwise) that specify actions to be takenby that machine. Further, while a single machine is illustrated, theterm “machine” shall also be taken to include any collection of machinesthat individually or jointly execute a set (or multiple sets) ofinstructions to perform any one or more of the methodologies discussedherein.

The machine may include a processor (e.g., a central processing unit(CPU), a graphics processing unit (GPU, or both), a main memory and astatic memory, which communicate with each other via a bus. The machinemay further include a video display unit (e.g., a liquid crystal display(LCD), a flat panel, a solid state display, or a cathode ray tube(CRT)). The machine may include an input device (e.g., a keyboard), acursor control device (e.g., a mouse), a disk drive unit, a signalgeneration device (e.g., a speaker or remote control) and a networkinterface device.

The disk drive unit may include a machine-readable medium on which isstored one or more sets of instructions (e.g., software) embodying anyone or more of the methodologies or functions described herein,including those methods illustrated above. The instructions may alsoreside, completely or at least partially, within the main memory, thestatic memory, and/or within the processor during execution thereof bythe machine. The main memory and the processor also may constitutemachine-readable media.

Dedicated hardware implementations including, but not limited to,application specific integrated circuits, programmable logic arrays andother hardware devices can likewise be constructed to implement themethods described herein. Applications that may include the apparatusand systems of various embodiments broadly include a variety ofelectronic and computer systems. Some embodiments implement functions intwo or more specific interconnected hardware modules or devices withrelated control and data signals communicated between and through themodules, or as portions of an application-specific integrated circuit.Thus, the example system is applicable to software, firmware, andhardware implementations.

In accordance with various embodiments of the present disclosure, themethods described herein are intended for operation as software programsrunning on a computer processor. Furthermore, software implementationscan include, but not limited to, distributed processing orcomponent/object distributed processing, parallel processing, or virtualmachine processing can also be constructed to implement the methodsdescribed herein.

The present disclosure contemplates a machine readable medium containinginstructions, or that which receives and executes instructions from apropagated signal so that a device connected to a network environmentcan send or receive voice, video or data, and to communicate over thenetwork using the instructions. The instructions may further betransmitted or received over a network via the network interface device.

While the machine-readable medium is shown in an example embodiment tobe a single medium, the term “machine-readable medium” should be takento include a single medium or multiple media (e.g., a centralized ordistributed database, and/or associated caches and servers) that storethe one or more sets of instructions. The term “machine-readable medium”shall also be taken to include any medium that is capable of storing,encoding or carrying a set of instructions for execution by the machineand that cause the machine to perform any one or more of themethodologies of the present disclosure.

The term “machine-readable medium” shall accordingly be taken toinclude, but not be limited to: solid-state memories such as a memorycard or other package that houses one or more read-only (non-volatile)memories, random access memories, or other re-writable (volatile)memories; magneto-optical or optical medium such as a disk or tape; orother self-contained information archive or set of archives isconsidered a distribution medium equivalent to a tangible storagemedium. Accordingly, the disclosure is considered to include any one ormore of a machine-readable medium or a distribution medium, as listedherein and including art-recognized equivalents and successor media, inwhich the software implementations herein are stored.

Although the present specification describes components and functionsimplemented in the embodiments with reference to particular standardsand protocols, the disclosure is not limited to such standards andprotocols. Each of the standards for Internet and other packet switchednetwork transmission (e.g., TCP/IP, UDP/IP, HTML, HTTP) representexamples of the state of the art. Such standards are periodicallysuperseded by faster or more efficient equivalents having essentiallythe same functions. Accordingly, replacement standards and protocolshaving the same functions are considered equivalents.

The illustrations of arrangements described herein are intended toprovide a general understanding, of the structure of variousembodiments, and they are not intended to serve as a completedescription of all the elements and features of apparatus and systemsthat might make use of the structures described herein. Many otherarrangements will be apparent to those of skill in the art uponreviewing the above description. Other arrangements may be utilized andderived therefrom, such that structural and logical substitutions andchanges may be made without departing from the scope of this disclosure.Figures are also merely representational and may not be drawn to scale.Certain proportions thereof may be exaggerated, while others may beminimized. Accordingly, the specification and drawings are to beregarded in an illustrative rather than a restrictive sense.

Thus, although specific arrangements have been illustrated and describedherein, it should be appreciated that any arrangement calculated toachieve the same purpose may be substituted for the specific arrangementshown. This disclosure is intended to cover any and all adaptations orvariations of various embodiments and arrangements of the invention.Combinations of the above arrangements, and other arrangements notspecifically described herein, will be apparent to those of skill in theart upon reviewing the above description. Therefore, it is intended thatthe disclosure not be limited to the particular arrangement(s) disclosedas the best mode contemplated for carrying out this invention, but thatthe invention will include all embodiments and arrangements fallingwithin the scope of the appended claims.

The above-described techniques can be implemented in digital electroniccircuitry, or in computer hardware, firmware, software, or incombinations of them. The implementation can be as a computer programproduct, i.e., a computer program tangibly embodied in an informationcarrier, e.g., in a machine-readable storage device or in a propagatedsignal, for execution by, or to control the operation of, dataprocessing apparatus, e.g., a programmable processor, a computer, ormultiple computers. A computer program can be written in any form ofprogramming language, including compiled or interpreted languages, andit can be deployed in any form, including as a stand-alone program or asa module, component, subroutine, or other unit suitable for use in acomputing environment. A computer program can be deployed to be executedon one computer or on multiple computers at one site or distributedacross multiple sites and interconnected by a communication network.

To provide for interaction with a user, the above described techniquescan be implemented on a computer having a display device, e.g., a CRT(cathode ray tube) or LCD (liquid crystal display) monitor, fordisplaying information to the user and a keyboard and a pointing device,e.g., a mouse or a trackball, by which the user can provide input to thecomputer (e.g., interact with a user interface element). Other kinds ofdevices can be used to provide for interaction with a user as well; forexample, feedback provided to the user can be any form of sensoryfeedback, e.g., visual feedback, auditory feedback, or tactile feedback;and input from the user can be received in any form, including acoustic,speech, or tactile input.

The computing system can include clients and servers. A client andserver are generally remote from each other and typically interactthrough a communication network. The relationship of client and serverarises by virtue of computer programs running on the respectivecomputers and having a client-server relationship to each other.

The technology has been described in terms of particular embodiments.The alternatives described herein are examples for illustration only andnot to limit the alternatives in any way. The steps of the invention canbe performed in a different order and still achieve desirable results.Other embodiments are within the scope of the following claims.

What is claimed is:
 1. A modular data center comprising: a controller; adata center control system configured to collect data center dataassociated with the modular data center via communication with one ofthe controller and a plurality of sensors; and a data module connectedto a power supply source, the power supply source comprising at leastone of a power grid, a backup power source and a power module, whereinthe power module comprises electronics equipment for conditioning anddistributing power to the one or more data modules, wherein the datamodule comprises: a first enclosure defining a first internal space; anda first sensor in the plurality of sensors, the first sensor incommunication with at least one of the controller and the data centercontrol system, and wherein the first enclosure is configured to containa heat exchanger configured to remove heat from air within the firstenclosure of the data module, and wherein a second sensor in theplurality of sensors in communication with the power supply source. 2.The modular data center of claim 1, further comprising a structuredisposed in t the data module, the structure separating the above-floorspace into a first aisle and a second aisle.
 3. The modular data centerof claim 1, wherein the structure comprises computing equipment.
 4. Themodular data center of claim 1, wherein the controller adjusts anenvironmental parameter of the data module based upon the data centerdata.
 5. The modular data center of claim 4, wherein the environmentalparameter is one of a temperature within the first enclosure, a pressurewithin the first enclosure, a humidity within the first enclosure, or anairflow speed within the first enclosure.
 6. The modular data center ofclaim 5, wherein the plurality of sensors are one of a power meter,temperature sensor, pressure sensor, humidity sensor, fan speed sensor,or valve position sensor.
 7. The modular data center of claim 6, furthercomprising a network operations center in the data module.
 8. Themodular data center of claim 7, wherein the data module is one of aplurality of data modules.
 9. The modular data center of claim 8,wherein the each data module in the plurality of data modules compriseat least one sensor of the plurality of sensors.
 10. The modular datacenter of claim 9, wherein the controller determines, based upon datareceived from the first sensor, an environmental condition of the datamodule.